SISET2023

The 4th International Symposium on Information Science and Engineering Technology will be held in Shanghai, China during Aug. 19-20, 2023.

This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to SISET 2023.


Publication

All accepted papers of the 4th SISET2023 will be published by the publisher. Conference proceedings is submitted to EI Compendex, CPCI-S, Scopus, and INSPEC for indexing. The excellent papers will be recommended to the SCI journal.
SISET2023最终录用的论文将提交至Ei检索。 优秀文章推荐到SCI计算机期刊发表
第一届SISET 2020,已由IOP:JPCS期刊出版已完成Ei检索 和 Scopus检索).
第二届SISET 2021,已由IEEE出版 ISBN: 978-1-6654-7876-2已完成Ei检索 和 Scopus检索).
第三届SISET 2022,已由IEEE出版 ISBN: 978-1-6654-8192-2已完成Ei检索 和 Scopus检索).

Call for Paper

Topics are not limited to:
  • Robotics
  • Computer Science
  • Artificial Intelligence
  • Electrical Engineering
  • Electronic Technology
  • Control and Automation Engineering

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Important Date

Submission Deadline: Aug. 25, 2023
Notification Date: One week after submission
Conference Date: Aug. 19-20, 2023

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Submission Method

Template (文章模板): Download.


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What's New


Sponsors

FAQ

Question: What's the requirement of the paper format?
Answer: Please click on "Paper Submission" to download the template.
Question: What's the limit for page counts?
Answer: Normally we expect the paper at least 5 pages. If the paper exceeds 5 pages, the extra fee will be required.
Question: How many papers can be submitted by each account?
Answer: Each account could handle 6 papers at most.

Contact US

Secretary: Mr. Zhao
Email: siset@foxmail.com
Tel: +86-13310186519
WeChat: 13310186519
QQ: 3079616102
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